Category Archives: Uncategorized

Link

PVA will be exhibiting at the upcoming cleaning and coating conference In Schaumburg IL. Registration information is below. We hope to see you there.

High-Reliability Cleaning and Conformal Coating Conference
November 18-20, 2014 Schaumburg, Illinois | Chicago Marriott Schaumburg
www.ipc.org/cleaning

PVA to display products at upcoming Assembly show in Rosemont IL

Join us as our special guest on October 28 – 30, with a FREE* registration to The ASSEMBLY Show. Use discount code PVAtas14 when registering online to take part in valuable networking and educational sessions focused exclusively on assembly. This is your one-stop event to experience a resource-rich expo floor with live demonstrations and working machinery of the latest assembly technology, equipment and products.

SMTAI 2014 Located in Rosemont IL

The 2014 SMTAI show will be held September 30th and October 1st at the Donald E Stephens center in Rosemont IL. The show will feature many of the product lines we represent AIM, CCI, Flexlink, Fuji and Heller along with many other major suppliers to our industry. We look forward to seeing you there. Click on the image below and you can register for this upcoming show.

 

 

 

Tin Whiskers Revelations: Part II – Can the Right Alloy Prevent Formation?

Phase 2 of our study involved wetting balance, spread, DSC and mechanical tests. We’re continuing our summary of a year-long experiment aimed at identifying lead-free solder alloys that mitigate tin whisker growth. This study cut right to the chase, beginning with an elimination round. The first phase knocked out two-thirds of the nine original candidate alloys based on their whisker production.

To read more about this article please visit the following link located on page 40:

http://ourdigitalmags.com/publication/?i=214760

 

 

Tin Whiskers Revelations: Part 1

THE ELUSIVE TIN WHISKER is only 1/100th the width of a human hair, but this tiny, single filament protrusion can wreak havoc with all sorts of electronics, and has even been cited as the cause of some sudden acceleration failures in cars. Tin whiskering is not a new phenomenon, however. It has been documented as far back as the 1940s, so why the heightened concern now? Lead was a great mitigator of whiskers and its removal from electronic solder opened the door for increased whisker proliferation, perhaps with sometimes deadly consequences.

To read more visit the following link and view pages 71 and 72

http://ourdigitalmags.com/publication/?i=206273